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 HD74HC283
4-bit Binary Full Adder
REJ03D0607-0200 (Previous ADE-205-485) Rev.2.00 Jan 31, 2006
Description
The sun () outputs are provided for each bit and the resultant carry (C4) is obtained from the fourth bit. This adder features full internal look ahead across all four bits. This provides the system designer with partial look-ahead performance at the economy and reduced package count of a ripple-carry implementation. The adder logic, including the carry, is implemented in its true for meaning that the end-around carry can be accomplished without the need for logic or level inversion.
Features
* * * * * * High Speed Operation: tpd = 19 ns typ (CL = 50 pF) High Output Current: Fanout of 10 LSTTL Loads Wide Operating Voltage: VCC = 2 to 6 V Low Input Current: 1 A max Low Quiescent Supply Current: ICC (static) = 4 A max (Ta = 25C) Ordering Information
Part Name HD74HC283P HD74HC283FPEL HD74HC283RPEL Package Type DILP-16 pin SOP-16 pin (JEITA) SOP-16 pin (JEDEC) Package Code (Previous Code) PRDP0016AE-B (DP-16FV) PRSP0016DH-B (FP-16DAV) PRSP0016DG-A (FP-16DNV) Package Abbreviation P FP RP -- EL (2,000 pcs/reel) EL (2,500 pcs/reel) Taping Abbreviation (Quantity)
Note: Please consult the sales office for the above package availability.
Rev.2.00 Jan 31, 2006 page 1 of 7
HD74HC283
Function Table
Inputs A1/A3 L H L H L H L H L H L H L H L H B1/B3 L L H H L L H H L L H H L L H H A2/A4 L L L L H H H H L L L L H H H H B2/B4 L L L L L L L L H H H H H H H H Outputs When C0 = L/When C2 = L 1/3 2/4 C2/C4 L L L H L L H L L L H L L H L H H L H H L L L H L H L H H L H H L L L H L L H H L H H L H L H H When C0 = H/When C2 = H 1/3 2/4 C2/C4 H L L L H L L H L H H L H H L L L H L L H H L H H H L L L H L L H H L H H L H L H H L H H H H H
H : high level L : low level Note: Input conditions at A1, B1, A2, B2, and C0 are used to determine outputs 1 and 2 and the value of the internal carry C2. The values at C2, A3, B3, A4 and B4 are then used to determine outputs 3, 4 and C4.
Pin Arrangement
2 B2 A2 1 A1 B1 C0 GND 1 2 3 4 5 6 7 8 B2 A2 1 A1 B1 C0 C4 2 B3 A3 3 A4 B4 4 16 VCC 15 B3 14 A3 13 3 12 A4 11 B4 10 4 9 C4
(Top view)
Rev.2.00 Jan 31, 2006 page 2 of 7
HD74HC283
Logic Diagram
C4
B4 A4 4
B3 A3 3 B2 A2 2 B1 A1
C0
1
Absolute Maximum Ratings
Item Supply voltage range Input / Output voltage Input / Output diode current Output current VCC, GND current Power dissipation Storage temperature Symbol VCC VIN, VOUT IIK, IOK IO ICC or IGND PT Tstg Ratings -0.5 to 7.0 -0.5 to VCC +0.5 20 25 50 500 -65 to +150 Unit V V mA mA mA mW C
Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of which may be realized at the same time.
Rev.2.00 Jan 31, 2006 page 3 of 7
HD74HC283
Recommended Operating Conditions
Item Supply voltage Input / Output voltage Operating temperature Input rise / fall time*1 Symbol VCC VIN, VOUT Ta tr, tf Ratings 2 to 6 0 to VCC -40 to 85 0 to 1000 0 to 500 0 to 400 Unit V V C ns Conditions
VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
Notes: 1. This item guarantees maximum limit when one input switches. Waveform: Refer to test circuit of switching characteristics.
Electrical Characteristics
Item Input voltage Symbol VCC (V) VIH 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 6.0 6.0 Ta = 25C Min Typ Max 1.5 -- -- 3.15 -- -- 4.2 -- -- -- -- -- 1.9 4.4 5.9 4.18 5.68 -- -- -- -- -- -- -- -- -- -- 2.0 4.5 6.0 -- -- 0.0 0.0 0.0 -- -- -- -- 0.5 1.35 1.8 -- -- -- -- -- 0.1 0.1 0.1 0.26 0.26 0.1 4.0 Ta = -40 to+85C Unit Min Max 1.5 -- V 3.15 -- 4.2 -- -- -- -- 1.9 4.4 5.9 4.13 5.63 -- -- -- -- -- -- -- 0.5 1.35 1.8 -- -- -- -- -- 0.1 0.1 0.1 0.33 0.33 1.0 40 V Test Conditions
VIL
Output voltage
VOH
V
Vin = VIH or VIL IOH = -20 A
VOL
V
Vin = VIH or VIL
IOH = -4 mA IOH = -5.2 mA IOL = 20 A
Input current Quiescent supply current
Iin ICC
IOL = 4 mA IOL = 5.2 mA A Vin = VCC or GND A Vin = VCC or GND, Iout = 0 A
Rev.2.00 Jan 31, 2006 page 4 of 7
HD74HC283
Switching Characteristics
(CL = 50 pF, Input tr = tf = 6 ns)
Item Propagation delay time Symbol VCC (V) tPLH tPHL tPLH tPHL tPLH tPHL tPLH tPHL Output rise/fall time Input capacitance tTLH tTHL Cin 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 -- Min -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Ta = 25C Typ Max -- 150 19 30 -- 26 -- 150 19 30 -- 26 -- 150 19 30 -- 26 -- 150 19 30 -- 26 -- 75 5 15 -- 13 5 10 Ta = -40 to +85C Unit Test Conditions Min Max -- 190 ns C0 to 1 -- 38 -- 33 -- 190 ns A1 or B1 to 1 -- 38 -- 33 -- 190 ns C0 to C4 -- 38 -- 33 -- 190 ns A1 or B1 to C4 -- 38 -- 33 -- 95 ns -- 19 -- 16 -- 10 pF
Test Circuit
VCC VCC Output A1 B1 A2 B2 A3 B3 A4 B4 C0
Input Pulse Generator Zout = 50
See Function Table
C4 Output 1 Output 4 CL = 50 pF CL = 50 pF CL = 50 pF
Note : 1. CL includes probe and jig capacitance.
Rev.2.00 Jan 31, 2006 page 5 of 7
HD74HC283
Waveforms
* Waveform - 1
tr 90 % 50 % 10 % t PLH 90 % 50 % 10 % t TLH 90 % 50 % 10 % t PHL 90 % 50 % 10 % t THL VOH VOL tf VCC 0V
Input
Same-phase output
t PHL 90 %
t PLH
Inverse-phase output
90 % 50 % 10 % t THL 50 % 10 % t TLH
VOH VOL
Note : 1. Input waveform : PRR 1 MHz, duty cycle 50%, tr 6 ns, tf 6 ns
Package Dimensions
JEITA Package Code P-DIP16-6.3x19.2-2.54 RENESAS Code PRDP0016AE-B Previous Code DP-16FV MASS[Typ.] 1.05g
D
16
9
1 0.89 b3
8
Z
E
A1
A
Reference Symbol
Dimension in Millimeters Min Nom 7.62 19.2 6.3 20.32 7.4 5.06 0.51 0.40 0.48 1.30 0.19 0 2.29 2.54 0.25 0.31 15 2.79 1.12 2.54 0.56 Max
e D E
L
1
A A1
e
bp
e1
b c b c
p 3
e Z ( Ni/Pd/Au plating ) L
Rev.2.00 Jan 31, 2006 page 6 of 7
HD74HC283
JEITA Package Code P-SOP16-5.5x10.06-1.27 RENESAS Code PRSP0016DH-B Previous Code FP-16DAV MASS[Typ.] 0.24g
*1
D F 9
16
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
HE
E
Index mark
Reference Symbol
*2
c
Dimension in Millimeters Min Nom 10.06 5.50 Max 10.5
Terminal cross section ( Ni/Pd/Au plating )
1 Z e
*3
D E A2
8 bp x M L1
A1 A bp b1 c
0.00
0.10
0.20 2.20
0.34
0.40
0.46
0.15
1
0.20
0.25
A
c
HE
0 7.50 7.80 1.27
8 8.00
A1
y L
e x y
0.12 0.15 0.80 0.50
1
Detail F
Z L L 0.70 1.15
0.90
JEITA Package Code P-SOP16-3.95x9.9-1.27
RENESAS Code PRSP0016DG-A
Previous Code FP-16DNV
MASS[Typ.] 0.15g
*1
D 9
F
16
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
Index mark
*2
E
HE
c
Reference Symbol
Dimension in Millimeters Min Nom 9.90 3.95 Max 10.30
Terminal cross section ( Ni/Pd/Au plating )
1 Z e
*3
D E A2
8 bp x M L1
A1 A bp b1 c c
1
0.10
0.14
0.25 1.75
0.34
0.40
0.46
0.15
0.20
0.25
HE
0 5.80 6.10 1.27
8 6.20
A
A1
L y
e x y
0.25 0.15 0.635 0.40
1
Detail F
Z L L 0.60 1.08
1.27
Rev.2.00 Jan 31, 2006 page 7 of 7
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 205, AZIA Center, No.133 Yincheng Rd (n), Pudong District, Shanghai 200120, China Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
(c) 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .5.0


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